燙金基(ji)本工藝是在壓力(li)狀態，即電(dian)化(hua)(hua)(hua)鋁被(bei)燙印(yin)版(ban)、承印(yin)物(wu)(wu)壓住的狀態下，電(dian)化(hua)(hua)(hua)鋁受(shou)(shou)熱(re)(re)使其上(shang)熱(re)(re)熔(rong)(rong)性(xing)的有(you)機硅樹脂層和膠(jiao)牯劑熔(rong)(rong)化(hua)(hua)(hua)，此時受(shou)(shou)熱(re)(re)熔(rong)(rong)化(hua)(hua)(hua)的有(you)機硅樹脂粘(zhan)性(xing)變(bian)小，而特種熱(re)(re)敏膠(jiao)粘(zhan)劑受(shou)(shou)熱(re)(re)熔(rong)(rong)化(hua)(hua)(hua)后粘(zhan)性(xing)增加(jia)，使得鋁層與電(dian)化(hua)(hua)(hua)鋁基(ji)膜剝(bo)離的同時轉印(yin)到了承印(yin)物(wu)(wu)上(shang)。隨著壓力(li)的卸除，膠(jiao)粘(zhan)劑迅速冷卻固化(hua)(hua)(hua)，鋁層牢固地(di)附著在承印(yin)物(wu)(wu)上(shang)，完成一(yi)個燙印(yin)過程。