燙金基本工藝是在壓(ya)(ya)(ya)力狀態(tai)，即(ji)電(dian)化(hua)鋁(lv)(lv)被燙印(yin)版、承(cheng)印(yin)物壓(ya)(ya)(ya)住的(de)狀態(tai)下，電(dian)化(hua)鋁(lv)(lv)受(shou)(shou)熱(re)使其上(shang)熱(re)熔(rong)性(xing)的(de)有機硅樹(shu)脂層和膠(jiao)牯劑(ji)熔(rong)化(hua)，此時受(shou)(shou)熱(re)熔(rong)化(hua)的(de)有機硅樹(shu)脂粘(zhan)性(xing)變小，而(er)特(te)種熱(re)敏(min)膠(jiao)粘(zhan)劑(ji)受(shou)(shou)熱(re)熔(rong)化(hua)后粘(zhan)性(xing)增(zeng)加，使得鋁(lv)(lv)層與電(dian)化(hua)鋁(lv)(lv)基膜剝離的(de)同(tong)時轉(zhuan)印(yin)到了承(cheng)印(yin)物上(shang)。隨著(zhu)壓(ya)(ya)(ya)力的(de)卸除，膠(jiao)粘(zhan)劑(ji)迅(xun)速(su)冷卻(que)固(gu)化(hua)，鋁(lv)(lv)層牢固(gu)地附著(zhu)在承(cheng)印(yin)物上(shang)，完成一個燙印(yin)過程。