燙金基(ji)本工藝是(shi)在壓(ya)力(li)狀態，即電化(hua)鋁被燙印版、承(cheng)印物壓(ya)住的(de)(de)狀態下(xia)，電化(hua)鋁受熱(re)(re)使其上熱(re)(re)熔(rong)(rong)(rong)性的(de)(de)有機硅樹(shu)脂層(ceng)(ceng)(ceng)和(he)膠(jiao)牯劑熔(rong)(rong)(rong)化(hua)，此時(shi)受熱(re)(re)熔(rong)(rong)(rong)化(hua)的(de)(de)有機硅樹(shu)脂粘(zhan)(zhan)性變小(xiao)，而特(te)種(zhong)熱(re)(re)敏膠(jiao)粘(zhan)(zhan)劑受熱(re)(re)熔(rong)(rong)(rong)化(hua)后(hou)粘(zhan)(zhan)性增加，使得鋁層(ceng)(ceng)(ceng)與(yu)電化(hua)鋁基(ji)膜剝(bo)離的(de)(de)同(tong)時(shi)轉印到(dao)了承(cheng)印物上。隨著壓(ya)力(li)的(de)(de)卸除，膠(jiao)粘(zhan)(zhan)劑迅速冷(leng)卻固化(hua)，鋁層(ceng)(ceng)(ceng)牢固地附著在承(cheng)印物上，完成一(yi)個(ge)燙印過程。