燙(tang)金(jin)基(ji)本工藝(yi)是(shi)在壓力狀態，即電(dian)化(hua)(hua)鋁(lv)被燙(tang)印(yin)版、承(cheng)(cheng)印(yin)物(wu)壓住的狀態下(xia)，電(dian)化(hua)(hua)鋁(lv)受(shou)熱使其上(shang)熱熔(rong)性的有機硅樹脂(zhi)(zhi)層(ceng)(ceng)和膠(jiao)牯劑熔(rong)化(hua)(hua)，此(ci)時受(shou)熱熔(rong)化(hua)(hua)的有機硅樹脂(zhi)(zhi)粘性變小，而特種(zhong)熱敏膠(jiao)粘劑受(shou)熱熔(rong)化(hua)(hua)后粘性增加(jia)，使得(de)鋁(lv)層(ceng)(ceng)與電(dian)化(hua)(hua)鋁(lv)基(ji)膜剝(bo)離(li)的同(tong)時轉印(yin)到了(le)承(cheng)(cheng)印(yin)物(wu)上(shang)。隨著壓力的卸除，膠(jiao)粘劑迅速冷卻固化(hua)(hua)，鋁(lv)層(ceng)(ceng)牢(lao)固地附著在承(cheng)(cheng)印(yin)物(wu)上(shang)，完成一個(ge)燙(tang)印(yin)過程。