燙金基本工藝是在壓(ya)力狀態，即電(dian)化(hua)(hua)鋁(lv)(lv)被燙印版、承(cheng)印物(wu)(wu)壓(ya)住的(de)狀態下(xia)，電(dian)化(hua)(hua)鋁(lv)(lv)受熱(re)(re)使(shi)其(qi)上(shang)熱(re)(re)熔(rong)(rong)性(xing)的(de)有(you)機硅樹脂(zhi)層(ceng)和(he)膠牯劑(ji)熔(rong)(rong)化(hua)(hua)，此(ci)時受熱(re)(re)熔(rong)(rong)化(hua)(hua)的(de)有(you)機硅樹脂(zhi)粘性(xing)變小，而特種熱(re)(re)敏膠粘劑(ji)受熱(re)(re)熔(rong)(rong)化(hua)(hua)后粘性(xing)增(zeng)加，使(shi)得鋁(lv)(lv)層(ceng)與電(dian)化(hua)(hua)鋁(lv)(lv)基膜剝離(li)的(de)同時轉(zhuan)印到了承(cheng)印物(wu)(wu)上(shang)。隨著壓(ya)力的(de)卸除，膠粘劑(ji)迅速(su)冷卻固化(hua)(hua)，鋁(lv)(lv)層(ceng)牢固地附著在承(cheng)印物(wu)(wu)上(shang)，完成一(yi)個燙印過(guo)程。