燙(tang)金基(ji)(ji)本工藝是在(zai)壓力(li)狀(zhuang)態，即電(dian)化(hua)(hua)(hua)鋁被(bei)燙(tang)印(yin)(yin)版、承印(yin)(yin)物壓住的狀(zhuang)態下，電(dian)化(hua)(hua)(hua)鋁受(shou)熱(re)使其上熱(re)熔(rong)性(xing)的有(you)機(ji)硅樹(shu)脂層(ceng)和膠牯劑(ji)熔(rong)化(hua)(hua)(hua)，此時(shi)受(shou)熱(re)熔(rong)化(hua)(hua)(hua)的有(you)機(ji)硅樹(shu)脂粘性(xing)變(bian)小，而特(te)種熱(re)敏膠粘劑(ji)受(shou)熱(re)熔(rong)化(hua)(hua)(hua)后粘性(xing)增加，使得鋁層(ceng)與電(dian)化(hua)(hua)(hua)鋁基(ji)(ji)膜剝離的同時(shi)轉(zhuan)印(yin)(yin)到(dao)了承印(yin)(yin)物上。隨著(zhu)壓力(li)的卸除，膠粘劑(ji)迅速冷卻固化(hua)(hua)(hua)，鋁層(ceng)牢(lao)固地附著(zhu)在(zai)承印(yin)(yin)物上，完成一個燙(tang)印(yin)(yin)過程。