燙(tang)金基(ji)本工藝是(shi)在(zai)(zai)壓(ya)力狀(zhuang)態(tai)，即電(dian)化(hua)鋁被燙(tang)印(yin)(yin)版、承印(yin)(yin)物壓(ya)住的(de)狀(zhuang)態(tai)下，電(dian)化(hua)鋁受(shou)(shou)(shou)熱(re)(re)使(shi)(shi)其上熱(re)(re)熔(rong)性(xing)的(de)有機(ji)(ji)硅樹脂(zhi)層(ceng)和膠(jiao)(jiao)(jiao)牯劑熔(rong)化(hua)，此(ci)時(shi)受(shou)(shou)(shou)熱(re)(re)熔(rong)化(hua)的(de)有機(ji)(ji)硅樹脂(zhi)粘(zhan)性(xing)變小，而特種熱(re)(re)敏(min)膠(jiao)(jiao)(jiao)粘(zhan)劑受(shou)(shou)(shou)熱(re)(re)熔(rong)化(hua)后粘(zhan)性(xing)增加，使(shi)(shi)得鋁層(ceng)與電(dian)化(hua)鋁基(ji)膜(mo)剝(bo)離的(de)同(tong)時(shi)轉印(yin)(yin)到了承印(yin)(yin)物上。隨著(zhu)壓(ya)力的(de)卸除，膠(jiao)(jiao)(jiao)粘(zhan)劑迅速(su)冷卻(que)固(gu)化(hua)，鋁層(ceng)牢固(gu)地附著(zhu)在(zai)(zai)承印(yin)(yin)物上，完成一個燙(tang)印(yin)(yin)過程。