燙金(jin)基(ji)本工藝是在壓力狀(zhuang)(zhuang)態，即電(dian)化(hua)鋁(lv)(lv)被燙印(yin)版、承印(yin)物(wu)壓住的(de)(de)狀(zhuang)(zhuang)態下(xia)，電(dian)化(hua)鋁(lv)(lv)受(shou)熱(re)(re)使(shi)其上熱(re)(re)熔(rong)(rong)性的(de)(de)有機硅樹脂層(ceng)(ceng)和膠牯(gu)劑(ji)熔(rong)(rong)化(hua)，此時(shi)受(shou)熱(re)(re)熔(rong)(rong)化(hua)的(de)(de)有機硅樹脂粘(zhan)性變(bian)小(xiao)，而特種(zhong)熱(re)(re)敏膠粘(zhan)劑(ji)受(shou)熱(re)(re)熔(rong)(rong)化(hua)后粘(zhan)性增加，使(shi)得鋁(lv)(lv)層(ceng)(ceng)與電(dian)化(hua)鋁(lv)(lv)基(ji)膜(mo)剝離(li)的(de)(de)同時(shi)轉印(yin)到(dao)了承印(yin)物(wu)上。隨著壓力的(de)(de)卸(xie)除(chu)，膠粘(zhan)劑(ji)迅速冷卻固(gu)化(hua)，鋁(lv)(lv)層(ceng)(ceng)牢固(gu)地附著在承印(yin)物(wu)上，完成一個燙印(yin)過程。