燙(tang)金基本工藝是在壓(ya)力狀態，即電(dian)化(hua)(hua)(hua)(hua)鋁(lv)(lv)(lv)被燙(tang)印版、承印物壓(ya)住的(de)狀態下，電(dian)化(hua)(hua)(hua)(hua)鋁(lv)(lv)(lv)受熱(re)使其上熱(re)熔(rong)(rong)性(xing)(xing)(xing)的(de)有機硅樹(shu)脂(zhi)(zhi)層和(he)膠牯劑熔(rong)(rong)化(hua)(hua)(hua)(hua)，此時受熱(re)熔(rong)(rong)化(hua)(hua)(hua)(hua)的(de)有機硅樹(shu)脂(zhi)(zhi)粘性(xing)(xing)(xing)變小，而特種熱(re)敏膠粘劑受熱(re)熔(rong)(rong)化(hua)(hua)(hua)(hua)后(hou)粘性(xing)(xing)(xing)增加，使得鋁(lv)(lv)(lv)層與(yu)電(dian)化(hua)(hua)(hua)(hua)鋁(lv)(lv)(lv)基膜(mo)剝(bo)離的(de)同時轉印到了承印物上。隨著壓(ya)力的(de)卸(xie)除，膠粘劑迅速冷(leng)卻固化(hua)(hua)(hua)(hua)，鋁(lv)(lv)(lv)層牢固地(di)附著在承印物上，完成一個燙(tang)印過(guo)程。