燙(tang)金基(ji)本工藝(yi)是在(zai)壓(ya)(ya)力(li)(li)狀態(tai)(tai)，即電(dian)(dian)化(hua)鋁被燙(tang)印(yin)版、承印(yin)物(wu)(wu)壓(ya)(ya)住的狀態(tai)(tai)下，電(dian)(dian)化(hua)鋁受(shou)熱使其(qi)上(shang)(shang)熱熔(rong)性(xing)(xing)的有(you)機(ji)硅(gui)樹(shu)脂(zhi)層(ceng)和膠牯(gu)劑熔(rong)化(hua)，此時受(shou)熱熔(rong)化(hua)的有(you)機(ji)硅(gui)樹(shu)脂(zhi)粘性(xing)(xing)變小，而特(te)種熱敏(min)膠粘劑受(shou)熱熔(rong)化(hua)后粘性(xing)(xing)增加，使得鋁層(ceng)與電(dian)(dian)化(hua)鋁基(ji)膜剝離的同時轉印(yin)到了承印(yin)物(wu)(wu)上(shang)(shang)。隨著(zhu)壓(ya)(ya)力(li)(li)的卸除，膠粘劑迅速冷卻固化(hua)，鋁層(ceng)牢固地附(fu)著(zhu)在(zai)承印(yin)物(wu)(wu)上(shang)(shang)，完成(cheng)一個燙(tang)印(yin)過程。