燙金基本工藝(yi)是(shi)在(zai)壓力狀(zhuang)態，即電化(hua)(hua)鋁(lv)被燙印(yin)(yin)(yin)版、承印(yin)(yin)(yin)物壓住的狀(zhuang)態下，電化(hua)(hua)鋁(lv)受(shou)熱使(shi)其上熱熔(rong)(rong)(rong)性(xing)的有機硅樹(shu)脂層(ceng)(ceng)和(he)膠牯劑熔(rong)(rong)(rong)化(hua)(hua)，此時(shi)受(shou)熱熔(rong)(rong)(rong)化(hua)(hua)的有機硅樹(shu)脂粘(zhan)(zhan)性(xing)變小(xiao)，而特種(zhong)熱敏膠粘(zhan)(zhan)劑受(shou)熱熔(rong)(rong)(rong)化(hua)(hua)后粘(zhan)(zhan)性(xing)增加，使(shi)得(de)鋁(lv)層(ceng)(ceng)與電化(hua)(hua)鋁(lv)基膜剝(bo)離的同(tong)時(shi)轉印(yin)(yin)(yin)到了承印(yin)(yin)(yin)物上。隨著壓力的卸除(chu)，膠粘(zhan)(zhan)劑迅速冷卻固化(hua)(hua)，鋁(lv)層(ceng)(ceng)牢固地附著在(zai)承印(yin)(yin)(yin)物上，完成(cheng)一個(ge)燙印(yin)(yin)(yin)過程(cheng)。