燙金(jin)基(ji)本工藝是在(zai)壓力狀(zhuang)(zhuang)態(tai)，即電(dian)化(hua)(hua)(hua)鋁被(bei)燙印(yin)(yin)版、承印(yin)(yin)物壓住的(de)狀(zhuang)(zhuang)態(tai)下(xia)，電(dian)化(hua)(hua)(hua)鋁受熱(re)使其上(shang)熱(re)熔(rong)(rong)性的(de)有機硅樹脂層(ceng)和膠牯劑(ji)熔(rong)(rong)化(hua)(hua)(hua)，此時受熱(re)熔(rong)(rong)化(hua)(hua)(hua)的(de)有機硅樹脂粘性變(bian)小，而(er)特種熱(re)敏膠粘劑(ji)受熱(re)熔(rong)(rong)化(hua)(hua)(hua)后粘性增加，使得鋁層(ceng)與(yu)電(dian)化(hua)(hua)(hua)鋁基(ji)膜剝離的(de)同(tong)時轉(zhuan)印(yin)(yin)到了承印(yin)(yin)物上(shang)。隨著(zhu)壓力的(de)卸除，膠粘劑(ji)迅速(su)冷(leng)卻固(gu)化(hua)(hua)(hua)，鋁層(ceng)牢(lao)固(gu)地附(fu)著(zhu)在(zai)承印(yin)(yin)物上(shang)，完成(cheng)一個燙印(yin)(yin)過程。