燙(tang)(tang)金基(ji)(ji)本(ben)工藝是在壓(ya)力狀態，即電(dian)(dian)化鋁(lv)被燙(tang)(tang)印(yin)(yin)版(ban)、承(cheng)印(yin)(yin)物壓(ya)住的狀態下，電(dian)(dian)化鋁(lv)受熱(re)使其(qi)上熱(re)熔(rong)性(xing)(xing)的有機(ji)(ji)硅樹脂層(ceng)和膠牯劑(ji)熔(rong)化，此時(shi)(shi)受熱(re)熔(rong)化的有機(ji)(ji)硅樹脂粘(zhan)(zhan)性(xing)(xing)變(bian)小，而(er)特種(zhong)熱(re)敏膠粘(zhan)(zhan)劑(ji)受熱(re)熔(rong)化后粘(zhan)(zhan)性(xing)(xing)增加，使得鋁(lv)層(ceng)與電(dian)(dian)化鋁(lv)基(ji)(ji)膜(mo)剝離的同時(shi)(shi)轉印(yin)(yin)到了承(cheng)印(yin)(yin)物上。隨著壓(ya)力的卸除(chu)，膠粘(zhan)(zhan)劑(ji)迅速(su)冷(leng)卻固化，鋁(lv)層(ceng)牢(lao)固地附著在承(cheng)印(yin)(yin)物上，完成一個燙(tang)(tang)印(yin)(yin)過程。