燙(tang)金(jin)基(ji)本工藝是在壓力狀態(tai)，即電(dian)化(hua)(hua)鋁(lv)被燙(tang)印(yin)(yin)版(ban)、承(cheng)印(yin)(yin)物(wu)壓住的狀態(tai)下，電(dian)化(hua)(hua)鋁(lv)受(shou)(shou)熱使(shi)其上熱熔(rong)(rong)性的有機硅(gui)樹脂層(ceng)(ceng)和(he)膠(jiao)(jiao)牯劑熔(rong)(rong)化(hua)(hua)，此(ci)時受(shou)(shou)熱熔(rong)(rong)化(hua)(hua)的有機硅(gui)樹脂粘(zhan)性變(bian)小，而特種熱敏膠(jiao)(jiao)粘(zhan)劑受(shou)(shou)熱熔(rong)(rong)化(hua)(hua)后粘(zhan)性增加，使(shi)得(de)鋁(lv)層(ceng)(ceng)與電(dian)化(hua)(hua)鋁(lv)基(ji)膜(mo)剝(bo)離的同時轉印(yin)(yin)到(dao)了承(cheng)印(yin)(yin)物(wu)上。隨著(zhu)壓力的卸除，膠(jiao)(jiao)粘(zhan)劑迅速冷卻固(gu)化(hua)(hua)，鋁(lv)層(ceng)(ceng)牢固(gu)地附著(zhu)在承(cheng)印(yin)(yin)物(wu)上，完成一個(ge)燙(tang)印(yin)(yin)過程。