燙(tang)(tang)金基本工藝是在壓(ya)力(li)狀態，即電(dian)化(hua)(hua)(hua)鋁(lv)(lv)(lv)被燙(tang)(tang)印(yin)(yin)版(ban)、承(cheng)印(yin)(yin)物壓(ya)住(zhu)的(de)狀態下，電(dian)化(hua)(hua)(hua)鋁(lv)(lv)(lv)受熱使(shi)其上熱熔(rong)(rong)性的(de)有機硅(gui)樹脂層(ceng)和膠(jiao)牯劑熔(rong)(rong)化(hua)(hua)(hua)，此時受熱熔(rong)(rong)化(hua)(hua)(hua)的(de)有機硅(gui)樹脂粘(zhan)性變小，而特(te)種熱敏膠(jiao)粘(zhan)劑受熱熔(rong)(rong)化(hua)(hua)(hua)后粘(zhan)性增(zeng)加，使(shi)得(de)鋁(lv)(lv)(lv)層(ceng)與電(dian)化(hua)(hua)(hua)鋁(lv)(lv)(lv)基膜剝(bo)離(li)的(de)同時轉(zhuan)印(yin)(yin)到(dao)了承(cheng)印(yin)(yin)物上。隨著壓(ya)力(li)的(de)卸除，膠(jiao)粘(zhan)劑迅(xun)速冷卻固化(hua)(hua)(hua)，鋁(lv)(lv)(lv)層(ceng)牢固地附著在承(cheng)印(yin)(yin)物上，完成一個燙(tang)(tang)印(yin)(yin)過程。