燙(tang)(tang)金基(ji)本工藝是(shi)在壓(ya)力(li)狀態，即電(dian)化(hua)(hua)鋁被燙(tang)(tang)印版、承印物(wu)壓(ya)住的(de)狀態下(xia)，電(dian)化(hua)(hua)鋁受(shou)熱使其(qi)上熱熔(rong)性(xing)的(de)有機(ji)硅樹脂(zhi)層(ceng)和膠(jiao)(jiao)(jiao)牯劑熔(rong)化(hua)(hua)，此(ci)時受(shou)熱熔(rong)化(hua)(hua)的(de)有機(ji)硅樹脂(zhi)粘(zhan)性(xing)變小，而特(te)種熱敏膠(jiao)(jiao)(jiao)粘(zhan)劑受(shou)熱熔(rong)化(hua)(hua)后粘(zhan)性(xing)增加(jia)，使得(de)鋁層(ceng)與(yu)電(dian)化(hua)(hua)鋁基(ji)膜剝離(li)的(de)同時轉印到了承印物(wu)上。隨著壓(ya)力(li)的(de)卸除，膠(jiao)(jiao)(jiao)粘(zhan)劑迅速冷卻固化(hua)(hua)，鋁層(ceng)牢固地(di)附著在承印物(wu)上，完(wan)成一個燙(tang)(tang)印過(guo)程(cheng)。