燙(tang)金基本工藝是在壓(ya)力狀態(tai)，即(ji)電(dian)化(hua)鋁(lv)被燙(tang)印(yin)(yin)版、承印(yin)(yin)物(wu)壓(ya)住的狀態(tai)下，電(dian)化(hua)鋁(lv)受(shou)(shou)熱(re)(re)使(shi)其上(shang)(shang)熱(re)(re)熔(rong)(rong)性(xing)的有機硅樹(shu)脂(zhi)(zhi)層(ceng)和膠牯劑熔(rong)(rong)化(hua)，此時(shi)(shi)受(shou)(shou)熱(re)(re)熔(rong)(rong)化(hua)的有機硅樹(shu)脂(zhi)(zhi)粘性(xing)變小，而特種(zhong)熱(re)(re)敏膠粘劑受(shou)(shou)熱(re)(re)熔(rong)(rong)化(hua)后粘性(xing)增加，使(shi)得鋁(lv)層(ceng)與電(dian)化(hua)鋁(lv)基膜剝離的同時(shi)(shi)轉(zhuan)印(yin)(yin)到了承印(yin)(yin)物(wu)上(shang)(shang)。隨著壓(ya)力的卸除，膠粘劑迅速冷卻固化(hua)，鋁(lv)層(ceng)牢固地附著在承印(yin)(yin)物(wu)上(shang)(shang)，完成一個燙(tang)印(yin)(yin)過程(cheng)。