燙(tang)(tang)金基(ji)本工藝是在壓力狀態，即電(dian)(dian)化(hua)(hua)(hua)鋁(lv)(lv)被(bei)燙(tang)(tang)印(yin)版、承(cheng)印(yin)物(wu)壓住的(de)狀態下，電(dian)(dian)化(hua)(hua)(hua)鋁(lv)(lv)受(shou)熱(re)(re)使(shi)其上熱(re)(re)熔(rong)性(xing)的(de)有機硅樹脂層和(he)膠牯(gu)劑(ji)熔(rong)化(hua)(hua)(hua)，此時受(shou)熱(re)(re)熔(rong)化(hua)(hua)(hua)的(de)有機硅樹脂粘性(xing)變(bian)小(xiao)，而特種(zhong)熱(re)(re)敏膠粘劑(ji)受(shou)熱(re)(re)熔(rong)化(hua)(hua)(hua)后粘性(xing)增加，使(shi)得鋁(lv)(lv)層與電(dian)(dian)化(hua)(hua)(hua)鋁(lv)(lv)基(ji)膜剝離的(de)同(tong)時轉印(yin)到(dao)了承(cheng)印(yin)物(wu)上。隨著壓力的(de)卸除(chu)，膠粘劑(ji)迅速(su)冷卻固(gu)化(hua)(hua)(hua)，鋁(lv)(lv)層牢固(gu)地附著在承(cheng)印(yin)物(wu)上，完成一個燙(tang)(tang)印(yin)過程(cheng)。