燙(tang)金基本(ben)工藝是(shi)在壓力狀態，即電化(hua)鋁(lv)(lv)(lv)被燙(tang)印(yin)版、承(cheng)印(yin)物(wu)壓住的狀態下，電化(hua)鋁(lv)(lv)(lv)受(shou)熱使其上熱熔(rong)(rong)(rong)性(xing)(xing)的有機硅(gui)樹脂層(ceng)(ceng)(ceng)和膠(jiao)(jiao)牯劑(ji)熔(rong)(rong)(rong)化(hua)，此時(shi)受(shou)熱熔(rong)(rong)(rong)化(hua)的有機硅(gui)樹脂粘(zhan)(zhan)性(xing)(xing)變小，而特種熱敏膠(jiao)(jiao)粘(zhan)(zhan)劑(ji)受(shou)熱熔(rong)(rong)(rong)化(hua)后粘(zhan)(zhan)性(xing)(xing)增加，使得鋁(lv)(lv)(lv)層(ceng)(ceng)(ceng)與電化(hua)鋁(lv)(lv)(lv)基膜剝(bo)離(li)的同時(shi)轉(zhuan)印(yin)到了承(cheng)印(yin)物(wu)上。隨著壓力的卸除(chu)，膠(jiao)(jiao)粘(zhan)(zhan)劑(ji)迅速冷卻固化(hua)，鋁(lv)(lv)(lv)層(ceng)(ceng)(ceng)牢固地(di)附(fu)著在承(cheng)印(yin)物(wu)上，完成一個(ge)燙(tang)印(yin)過程。