燙(tang)(tang)金基本工藝是在壓力狀(zhuang)態(tai)，即電(dian)化(hua)(hua)鋁(lv)被燙(tang)(tang)印(yin)版(ban)、承印(yin)物(wu)壓住(zhu)的狀(zhuang)態(tai)下，電(dian)化(hua)(hua)鋁(lv)受(shou)(shou)熱(re)使(shi)其上(shang)熱(re)熔(rong)性(xing)的有機硅樹脂層(ceng)(ceng)和膠(jiao)(jiao)牯劑熔(rong)化(hua)(hua)，此時(shi)受(shou)(shou)熱(re)熔(rong)化(hua)(hua)的有機硅樹脂粘(zhan)性(xing)變(bian)小，而特種熱(re)敏膠(jiao)(jiao)粘(zhan)劑受(shou)(shou)熱(re)熔(rong)化(hua)(hua)后(hou)粘(zhan)性(xing)增(zeng)加，使(shi)得鋁(lv)層(ceng)(ceng)與電(dian)化(hua)(hua)鋁(lv)基膜(mo)剝離的同時(shi)轉印(yin)到了(le)承印(yin)物(wu)上(shang)。隨著(zhu)壓力的卸除，膠(jiao)(jiao)粘(zhan)劑迅速冷卻固化(hua)(hua)，鋁(lv)層(ceng)(ceng)牢固地附(fu)著(zhu)在承印(yin)物(wu)上(shang)，完成一個(ge)燙(tang)(tang)印(yin)過程。