燙金基本工藝是在(zai)(zai)壓(ya)力狀態(tai)，即電(dian)化(hua)(hua)鋁(lv)(lv)被燙印版、承印物壓(ya)住的狀態(tai)下(xia)，電(dian)化(hua)(hua)鋁(lv)(lv)受熱(re)(re)(re)使其上(shang)熱(re)(re)(re)熔(rong)性(xing)的有機(ji)硅樹脂(zhi)層(ceng)和膠牯劑(ji)熔(rong)化(hua)(hua)，此時受熱(re)(re)(re)熔(rong)化(hua)(hua)的有機(ji)硅樹脂(zhi)粘(zhan)性(xing)變小，而特種熱(re)(re)(re)敏(min)膠粘(zhan)劑(ji)受熱(re)(re)(re)熔(rong)化(hua)(hua)后粘(zhan)性(xing)增加，使得鋁(lv)(lv)層(ceng)與(yu)電(dian)化(hua)(hua)鋁(lv)(lv)基膜剝離的同時轉印到了承印物上(shang)。隨著(zhu)(zhu)壓(ya)力的卸除(chu)，膠粘(zhan)劑(ji)迅(xun)速(su)冷卻固(gu)化(hua)(hua)，鋁(lv)(lv)層(ceng)牢固(gu)地附著(zhu)(zhu)在(zai)(zai)承印物上(shang)，完成(cheng)一個燙印過程(cheng)。