燙(tang)金(jin)基(ji)本工藝是(shi)在壓(ya)力狀態(tai)，即電(dian)化(hua)鋁(lv)(lv)被燙(tang)印(yin)版、承印(yin)物壓(ya)住的狀態(tai)下，電(dian)化(hua)鋁(lv)(lv)受(shou)熱使(shi)其上熱熔(rong)性的有機硅樹脂(zhi)層(ceng)和膠(jiao)牯劑(ji)熔(rong)化(hua)，此時受(shou)熱熔(rong)化(hua)的有機硅樹脂(zhi)粘(zhan)(zhan)(zhan)性變小(xiao)，而特種熱敏膠(jiao)粘(zhan)(zhan)(zhan)劑(ji)受(shou)熱熔(rong)化(hua)后(hou)粘(zhan)(zhan)(zhan)性增加，使(shi)得鋁(lv)(lv)層(ceng)與電(dian)化(hua)鋁(lv)(lv)基(ji)膜剝(bo)離的同時轉(zhuan)印(yin)到了(le)承印(yin)物上。隨著壓(ya)力的卸除，膠(jiao)粘(zhan)(zhan)(zhan)劑(ji)迅速冷卻(que)固化(hua)，鋁(lv)(lv)層(ceng)牢固地附著在承印(yin)物上，完成一個燙(tang)印(yin)過程。