燙(tang)金基本工藝是在壓(ya)(ya)力狀態，即(ji)電(dian)化(hua)(hua)鋁被(bei)燙(tang)印版、承印物(wu)壓(ya)(ya)住的(de)狀態下，電(dian)化(hua)(hua)鋁受(shou)(shou)熱(re)使(shi)其上熱(re)熔(rong)性(xing)的(de)有機(ji)硅(gui)樹脂層(ceng)和膠(jiao)牯(gu)劑(ji)(ji)熔(rong)化(hua)(hua)，此時受(shou)(shou)熱(re)熔(rong)化(hua)(hua)的(de)有機(ji)硅(gui)樹脂粘(zhan)性(xing)變小，而特種熱(re)敏膠(jiao)粘(zhan)劑(ji)(ji)受(shou)(shou)熱(re)熔(rong)化(hua)(hua)后粘(zhan)性(xing)增(zeng)加(jia)，使(shi)得鋁層(ceng)與電(dian)化(hua)(hua)鋁基膜剝離(li)的(de)同時轉印到了承印物(wu)上。隨著壓(ya)(ya)力的(de)卸(xie)除，膠(jiao)粘(zhan)劑(ji)(ji)迅速冷(leng)卻固化(hua)(hua)，鋁層(ceng)牢固地附著在承印物(wu)上，完成一(yi)個燙(tang)印過程。