燙金基本工藝是在(zai)(zai)壓力狀態，即電化(hua)(hua)(hua)(hua)鋁(lv)被燙印(yin)版、承印(yin)物(wu)(wu)壓住的(de)狀態下，電化(hua)(hua)(hua)(hua)鋁(lv)受熱使其上熱熔(rong)(rong)性(xing)(xing)的(de)有機硅(gui)樹(shu)(shu)脂(zhi)層(ceng)和膠牯劑熔(rong)(rong)化(hua)(hua)(hua)(hua)，此時受熱熔(rong)(rong)化(hua)(hua)(hua)(hua)的(de)有機硅(gui)樹(shu)(shu)脂(zhi)粘(zhan)性(xing)(xing)變小，而(er)特種熱敏(min)膠粘(zhan)劑受熱熔(rong)(rong)化(hua)(hua)(hua)(hua)后粘(zhan)性(xing)(xing)增加(jia)，使得鋁(lv)層(ceng)與(yu)電化(hua)(hua)(hua)(hua)鋁(lv)基膜剝離的(de)同時轉(zhuan)印(yin)到了承印(yin)物(wu)(wu)上。隨著壓力的(de)卸除(chu)，膠粘(zhan)劑迅速(su)冷卻固(gu)化(hua)(hua)(hua)(hua)，鋁(lv)層(ceng)牢固(gu)地附著在(zai)(zai)承印(yin)物(wu)(wu)上，完成一個燙印(yin)過程。