燙金基(ji)本工藝(yi)是在壓(ya)力(li)狀(zhuang)態(tai)，即電(dian)化鋁(lv)(lv)被(bei)燙印(yin)(yin)版(ban)、承(cheng)印(yin)(yin)物(wu)(wu)壓(ya)住的(de)(de)狀(zhuang)態(tai)下(xia)，電(dian)化鋁(lv)(lv)受(shou)熱(re)使其上(shang)熱(re)熔(rong)(rong)(rong)性(xing)的(de)(de)有機硅樹(shu)脂(zhi)(zhi)層(ceng)和膠(jiao)牯(gu)劑熔(rong)(rong)(rong)化，此時受(shou)熱(re)熔(rong)(rong)(rong)化的(de)(de)有機硅樹(shu)脂(zhi)(zhi)粘性(xing)變小(xiao)，而特種熱(re)敏膠(jiao)粘劑受(shou)熱(re)熔(rong)(rong)(rong)化后粘性(xing)增加(jia)，使得鋁(lv)(lv)層(ceng)與(yu)電(dian)化鋁(lv)(lv)基(ji)膜剝離的(de)(de)同(tong)時轉印(yin)(yin)到了(le)承(cheng)印(yin)(yin)物(wu)(wu)上(shang)。隨著壓(ya)力(li)的(de)(de)卸除，膠(jiao)粘劑迅速冷卻固(gu)化，鋁(lv)(lv)層(ceng)牢(lao)固(gu)地附(fu)著在承(cheng)印(yin)(yin)物(wu)(wu)上(shang)，完成(cheng)一個燙印(yin)(yin)過程。