燙(tang)金(jin)基(ji)本工藝(yi)是(shi)在(zai)壓力(li)狀(zhuang)態(tai)，即電(dian)化鋁(lv)被燙(tang)印版、承(cheng)印物(wu)(wu)壓住的(de)(de)狀(zhuang)態(tai)下，電(dian)化鋁(lv)受熱(re)使(shi)其上熱(re)熔(rong)(rong)(rong)性的(de)(de)有(you)機(ji)硅(gui)(gui)樹(shu)脂層和(he)膠(jiao)牯劑(ji)熔(rong)(rong)(rong)化，此時受熱(re)熔(rong)(rong)(rong)化的(de)(de)有(you)機(ji)硅(gui)(gui)樹(shu)脂粘(zhan)(zhan)性變(bian)小，而特種熱(re)敏膠(jiao)粘(zhan)(zhan)劑(ji)受熱(re)熔(rong)(rong)(rong)化后(hou)粘(zhan)(zhan)性增加，使(shi)得鋁(lv)層與電(dian)化鋁(lv)基(ji)膜剝離的(de)(de)同(tong)時轉印到了承(cheng)印物(wu)(wu)上。隨(sui)著壓力(li)的(de)(de)卸(xie)除(chu)，膠(jiao)粘(zhan)(zhan)劑(ji)迅速(su)冷(leng)卻固化，鋁(lv)層牢固地附著在(zai)承(cheng)印物(wu)(wu)上，完成一(yi)個(ge)燙(tang)印過程(cheng)。