燙(tang)(tang)金基(ji)本工藝是在壓力狀態(tai)，即電化(hua)(hua)(hua)鋁(lv)(lv)被燙(tang)(tang)印(yin)(yin)版、承印(yin)(yin)物壓住(zhu)的狀態(tai)下，電化(hua)(hua)(hua)鋁(lv)(lv)受(shou)熱使其上熱熔(rong)(rong)性的有機硅樹(shu)脂層和膠(jiao)(jiao)牯(gu)劑熔(rong)(rong)化(hua)(hua)(hua)，此時受(shou)熱熔(rong)(rong)化(hua)(hua)(hua)的有機硅樹(shu)脂粘(zhan)性變(bian)小，而特種熱敏(min)膠(jiao)(jiao)粘(zhan)劑受(shou)熱熔(rong)(rong)化(hua)(hua)(hua)后粘(zhan)性增加，使得鋁(lv)(lv)層與電化(hua)(hua)(hua)鋁(lv)(lv)基(ji)膜剝離的同(tong)時轉(zhuan)印(yin)(yin)到了承印(yin)(yin)物上。隨(sui)著壓力的卸除，膠(jiao)(jiao)粘(zhan)劑迅速冷卻(que)固化(hua)(hua)(hua)，鋁(lv)(lv)層牢(lao)固地附著在承印(yin)(yin)物上，完成一個(ge)燙(tang)(tang)印(yin)(yin)過程(cheng)。