燙(tang)金基(ji)本工(gong)藝是在壓(ya)(ya)(ya)力狀態，即電化(hua)(hua)鋁(lv)(lv)(lv)被燙(tang)印版(ban)、承(cheng)印物(wu)壓(ya)(ya)(ya)住的狀態下，電化(hua)(hua)鋁(lv)(lv)(lv)受(shou)熱(re)(re)使其上熱(re)(re)熔(rong)(rong)(rong)性的有機硅樹脂層(ceng)和膠牯劑(ji)熔(rong)(rong)(rong)化(hua)(hua)，此(ci)時受(shou)熱(re)(re)熔(rong)(rong)(rong)化(hua)(hua)的有機硅樹脂粘(zhan)性變小，而特(te)種熱(re)(re)敏膠粘(zhan)劑(ji)受(shou)熱(re)(re)熔(rong)(rong)(rong)化(hua)(hua)后粘(zhan)性增加，使得(de)鋁(lv)(lv)(lv)層(ceng)與電化(hua)(hua)鋁(lv)(lv)(lv)基(ji)膜剝離的同時轉印到(dao)了承(cheng)印物(wu)上。隨著(zhu)壓(ya)(ya)(ya)力的卸(xie)除，膠粘(zhan)劑(ji)迅速冷(leng)卻(que)固(gu)化(hua)(hua)，鋁(lv)(lv)(lv)層(ceng)牢固(gu)地附著(zhu)在承(cheng)印物(wu)上，完(wan)成一個燙(tang)印過(guo)程(cheng)。