燙金基本工藝是在(zai)壓(ya)力狀態，即電(dian)化(hua)(hua)鋁(lv)被燙印(yin)版、承(cheng)印(yin)物壓(ya)住的(de)狀態下，電(dian)化(hua)(hua)鋁(lv)受(shou)熱(re)使(shi)其上(shang)熱(re)熔(rong)(rong)性(xing)(xing)的(de)有機硅樹(shu)脂(zhi)層和(he)膠牯劑熔(rong)(rong)化(hua)(hua)，此時受(shou)熱(re)熔(rong)(rong)化(hua)(hua)的(de)有機硅樹(shu)脂(zhi)粘(zhan)性(xing)(xing)變小(xiao)，而(er)特種熱(re)敏(min)膠粘(zhan)劑受(shou)熱(re)熔(rong)(rong)化(hua)(hua)后粘(zhan)性(xing)(xing)增加，使(shi)得鋁(lv)層與(yu)電(dian)化(hua)(hua)鋁(lv)基膜剝離(li)的(de)同時轉印(yin)到了承(cheng)印(yin)物上(shang)。隨著壓(ya)力的(de)卸(xie)除，膠粘(zhan)劑迅速冷卻固化(hua)(hua)，鋁(lv)層牢固地附著在(zai)承(cheng)印(yin)物上(shang)，完(wan)成一個燙印(yin)過程。