燙(tang)(tang)金基本工藝是(shi)在(zai)壓力(li)狀態，即電化(hua)(hua)鋁(lv)被燙(tang)(tang)印版(ban)、承(cheng)(cheng)印物(wu)壓住的(de)狀態下，電化(hua)(hua)鋁(lv)受(shou)熱(re)使(shi)其上(shang)熱(re)熔(rong)(rong)性的(de)有(you)機硅(gui)樹脂層和膠牯劑熔(rong)(rong)化(hua)(hua)，此時(shi)受(shou)熱(re)熔(rong)(rong)化(hua)(hua)的(de)有(you)機硅(gui)樹脂粘(zhan)性變小，而特種熱(re)敏膠粘(zhan)劑受(shou)熱(re)熔(rong)(rong)化(hua)(hua)后粘(zhan)性增加，使(shi)得鋁(lv)層與電化(hua)(hua)鋁(lv)基膜(mo)剝離的(de)同(tong)時(shi)轉印到(dao)了承(cheng)(cheng)印物(wu)上(shang)。隨著壓力(li)的(de)卸除，膠粘(zhan)劑迅速(su)冷卻固(gu)化(hua)(hua)，鋁(lv)層牢(lao)固(gu)地附著在(zai)承(cheng)(cheng)印物(wu)上(shang)，完成一個燙(tang)(tang)印過程。