燙(tang)金基本工藝是在(zai)壓力狀(zhuang)態(tai)，即電(dian)(dian)(dian)化(hua)(hua)(hua)鋁被(bei)燙(tang)印(yin)版、承(cheng)(cheng)印(yin)物壓住的狀(zhuang)態(tai)下，電(dian)(dian)(dian)化(hua)(hua)(hua)鋁受熱(re)使其(qi)上熱(re)熔(rong)性的有(you)機硅(gui)樹脂層(ceng)(ceng)和膠(jiao)牯(gu)劑熔(rong)化(hua)(hua)(hua)，此時受熱(re)熔(rong)化(hua)(hua)(hua)的有(you)機硅(gui)樹脂粘(zhan)(zhan)性變小，而(er)特種熱(re)敏膠(jiao)粘(zhan)(zhan)劑受熱(re)熔(rong)化(hua)(hua)(hua)后粘(zhan)(zhan)性增加(jia)，使得鋁層(ceng)(ceng)與電(dian)(dian)(dian)化(hua)(hua)(hua)鋁基膜剝離的同時轉印(yin)到了(le)承(cheng)(cheng)印(yin)物上。隨著壓力的卸除，膠(jiao)粘(zhan)(zhan)劑迅速冷卻固化(hua)(hua)(hua)，鋁層(ceng)(ceng)牢固地附著在(zai)承(cheng)(cheng)印(yin)物上，完成一個燙(tang)印(yin)過程。