燙金基(ji)本工藝是在壓力(li)狀態(tai)，即(ji)電(dian)化(hua)(hua)(hua)鋁(lv)被燙印(yin)(yin)版、承印(yin)(yin)物(wu)壓住的狀態(tai)下，電(dian)化(hua)(hua)(hua)鋁(lv)受(shou)熱(re)使其上熱(re)熔性(xing)的有機(ji)硅樹脂(zhi)層(ceng)和膠(jiao)(jiao)牯劑(ji)(ji)熔化(hua)(hua)(hua)，此時受(shou)熱(re)熔化(hua)(hua)(hua)的有機(ji)硅樹脂(zhi)粘(zhan)性(xing)變(bian)小(xiao)，而特種熱(re)敏膠(jiao)(jiao)粘(zhan)劑(ji)(ji)受(shou)熱(re)熔化(hua)(hua)(hua)后粘(zhan)性(xing)增加，使得鋁(lv)層(ceng)與電(dian)化(hua)(hua)(hua)鋁(lv)基(ji)膜剝離的同(tong)時轉印(yin)(yin)到了承印(yin)(yin)物(wu)上。隨著壓力(li)的卸除，膠(jiao)(jiao)粘(zhan)劑(ji)(ji)迅速冷卻(que)固化(hua)(hua)(hua)，鋁(lv)層(ceng)牢固地附著在承印(yin)(yin)物(wu)上，完(wan)成一個燙印(yin)(yin)過程。