燙金基(ji)本(ben)工藝是在(zai)壓力狀(zhuang)態(tai)，即(ji)電(dian)(dian)化(hua)(hua)鋁(lv)被(bei)燙印(yin)(yin)版、承印(yin)(yin)物(wu)壓住(zhu)的(de)狀(zhuang)態(tai)下，電(dian)(dian)化(hua)(hua)鋁(lv)受(shou)熱(re)使其上(shang)(shang)熱(re)熔(rong)性(xing)的(de)有機硅樹(shu)(shu)脂(zhi)(zhi)層和膠牯劑熔(rong)化(hua)(hua)，此時(shi)受(shou)熱(re)熔(rong)化(hua)(hua)的(de)有機硅樹(shu)(shu)脂(zhi)(zhi)粘(zhan)(zhan)性(xing)變(bian)小(xiao)，而特(te)種熱(re)敏膠粘(zhan)(zhan)劑受(shou)熱(re)熔(rong)化(hua)(hua)后粘(zhan)(zhan)性(xing)增(zeng)加，使得鋁(lv)層與(yu)電(dian)(dian)化(hua)(hua)鋁(lv)基(ji)膜剝離的(de)同時(shi)轉印(yin)(yin)到了承印(yin)(yin)物(wu)上(shang)(shang)。隨著壓力的(de)卸除，膠粘(zhan)(zhan)劑迅速冷卻固化(hua)(hua)，鋁(lv)層牢固地附著在(zai)承印(yin)(yin)物(wu)上(shang)(shang)，完成一個燙印(yin)(yin)過程。