燙(tang)金基(ji)本工藝是在壓(ya)(ya)力狀態，即(ji)電(dian)(dian)(dian)化(hua)(hua)鋁(lv)(lv)(lv)被燙(tang)印(yin)(yin)版(ban)、承印(yin)(yin)物壓(ya)(ya)住的(de)(de)狀態下(xia)，電(dian)(dian)(dian)化(hua)(hua)鋁(lv)(lv)(lv)受熱(re)使其上(shang)熱(re)熔性(xing)的(de)(de)有(you)(you)機(ji)硅樹脂層和膠牯劑熔化(hua)(hua)，此(ci)時受熱(re)熔化(hua)(hua)的(de)(de)有(you)(you)機(ji)硅樹脂粘(zhan)性(xing)變(bian)小，而特種(zhong)熱(re)敏膠粘(zhan)劑受熱(re)熔化(hua)(hua)后粘(zhan)性(xing)增(zeng)加，使得(de)鋁(lv)(lv)(lv)層與電(dian)(dian)(dian)化(hua)(hua)鋁(lv)(lv)(lv)基(ji)膜剝(bo)離的(de)(de)同(tong)時轉印(yin)(yin)到了承印(yin)(yin)物上(shang)。隨著壓(ya)(ya)力的(de)(de)卸除，膠粘(zhan)劑迅速(su)冷(leng)卻固(gu)(gu)化(hua)(hua)，鋁(lv)(lv)(lv)層牢固(gu)(gu)地附著在承印(yin)(yin)物上(shang)，完(wan)成一個(ge)燙(tang)印(yin)(yin)過程。