燙(tang)金基(ji)本工藝是在(zai)(zai)壓力(li)狀態(tai)，即電(dian)化(hua)(hua)鋁(lv)被燙(tang)印(yin)(yin)版、承印(yin)(yin)物(wu)壓住的(de)(de)(de)狀態(tai)下，電(dian)化(hua)(hua)鋁(lv)受(shou)(shou)熱(re)使(shi)其上(shang)熱(re)熔(rong)(rong)性的(de)(de)(de)有(you)機硅(gui)樹(shu)脂(zhi)層(ceng)和膠牯劑(ji)熔(rong)(rong)化(hua)(hua)，此(ci)時受(shou)(shou)熱(re)熔(rong)(rong)化(hua)(hua)的(de)(de)(de)有(you)機硅(gui)樹(shu)脂(zhi)粘(zhan)性變小(xiao)，而(er)特(te)種熱(re)敏膠粘(zhan)劑(ji)受(shou)(shou)熱(re)熔(rong)(rong)化(hua)(hua)后粘(zhan)性增加，使(shi)得鋁(lv)層(ceng)與電(dian)化(hua)(hua)鋁(lv)基(ji)膜剝(bo)離的(de)(de)(de)同(tong)時轉印(yin)(yin)到了(le)承印(yin)(yin)物(wu)上(shang)。隨著壓力(li)的(de)(de)(de)卸除(chu)，膠粘(zhan)劑(ji)迅速冷卻固(gu)化(hua)(hua)，鋁(lv)層(ceng)牢固(gu)地附著在(zai)(zai)承印(yin)(yin)物(wu)上(shang)，完成一個燙(tang)印(yin)(yin)過程。