燙金基本工藝是在壓力狀態，即電(dian)(dian)化(hua)(hua)鋁(lv)(lv)(lv)被燙印(yin)版(ban)、承印(yin)物(wu)壓住的(de)狀態下，電(dian)(dian)化(hua)(hua)鋁(lv)(lv)(lv)受熱(re)使其(qi)上(shang)(shang)熱(re)熔(rong)性(xing)的(de)有(you)機(ji)硅樹(shu)脂層和(he)膠牯(gu)劑(ji)熔(rong)化(hua)(hua)，此時受熱(re)熔(rong)化(hua)(hua)的(de)有(you)機(ji)硅樹(shu)脂粘(zhan)性(xing)變(bian)小(xiao)，而特種熱(re)敏膠粘(zhan)劑(ji)受熱(re)熔(rong)化(hua)(hua)后粘(zhan)性(xing)增加，使得鋁(lv)(lv)(lv)層與(yu)電(dian)(dian)化(hua)(hua)鋁(lv)(lv)(lv)基膜剝離的(de)同時轉印(yin)到了承印(yin)物(wu)上(shang)(shang)。隨著壓力的(de)卸除，膠粘(zhan)劑(ji)迅速冷卻固化(hua)(hua)，鋁(lv)(lv)(lv)層牢固地(di)附著在承印(yin)物(wu)上(shang)(shang)，完成一個燙印(yin)過程(cheng)。