燙金基本工藝(yi)是在壓力狀(zhuang)態(tai)，即電化鋁(lv)(lv)(lv)被燙印版、承印物壓住的(de)狀(zhuang)態(tai)下，電化鋁(lv)(lv)(lv)受(shou)熱(re)(re)使(shi)其上(shang)(shang)熱(re)(re)熔(rong)(rong)性(xing)的(de)有機硅樹脂層(ceng)(ceng)和膠(jiao)牯劑(ji)熔(rong)(rong)化，此時受(shou)熱(re)(re)熔(rong)(rong)化的(de)有機硅樹脂粘(zhan)性(xing)變小，而(er)特種熱(re)(re)敏膠(jiao)粘(zhan)劑(ji)受(shou)熱(re)(re)熔(rong)(rong)化后粘(zhan)性(xing)增(zeng)加，使(shi)得(de)鋁(lv)(lv)(lv)層(ceng)(ceng)與電化鋁(lv)(lv)(lv)基膜剝離的(de)同時轉(zhuan)印到了承印物上(shang)(shang)。隨著(zhu)壓力的(de)卸(xie)除，膠(jiao)粘(zhan)劑(ji)迅(xun)速冷卻(que)固化，鋁(lv)(lv)(lv)層(ceng)(ceng)牢固地附著(zhu)在承印物上(shang)(shang)，完成一個燙印過程(cheng)。