燙(tang)(tang)金基(ji)(ji)本工藝是在壓力(li)狀態，即電(dian)化(hua)(hua)(hua)鋁(lv)被燙(tang)(tang)印(yin)版、承印(yin)物壓住(zhu)的(de)狀態下，電(dian)化(hua)(hua)(hua)鋁(lv)受(shou)熱(re)(re)使(shi)其上(shang)熱(re)(re)熔(rong)性(xing)的(de)有(you)機硅樹脂層(ceng)和(he)膠牯劑熔(rong)化(hua)(hua)(hua)，此時受(shou)熱(re)(re)熔(rong)化(hua)(hua)(hua)的(de)有(you)機硅樹脂粘(zhan)性(xing)變小，而特種熱(re)(re)敏(min)膠粘(zhan)劑受(shou)熱(re)(re)熔(rong)化(hua)(hua)(hua)后(hou)粘(zhan)性(xing)增加，使(shi)得鋁(lv)層(ceng)與電(dian)化(hua)(hua)(hua)鋁(lv)基(ji)(ji)膜剝離的(de)同時轉印(yin)到了承印(yin)物上(shang)。隨著壓力(li)的(de)卸除，膠粘(zhan)劑迅速冷卻固化(hua)(hua)(hua)，鋁(lv)層(ceng)牢固地附著在承印(yin)物上(shang)，完成一(yi)個燙(tang)(tang)印(yin)過程。