燙(tang)金基(ji)本工藝(yi)是(shi)在(zai)(zai)壓力狀(zhuang)態，即電(dian)(dian)化鋁(lv)(lv)被燙(tang)印(yin)(yin)版、承(cheng)(cheng)印(yin)(yin)物壓住的狀(zhuang)態下，電(dian)(dian)化鋁(lv)(lv)受熱(re)(re)(re)使(shi)其上(shang)熱(re)(re)(re)熔(rong)性的有(you)機(ji)(ji)硅(gui)樹(shu)(shu)脂層(ceng)和(he)膠(jiao)牯劑熔(rong)化，此時受熱(re)(re)(re)熔(rong)化的有(you)機(ji)(ji)硅(gui)樹(shu)(shu)脂粘(zhan)性變(bian)小，而特種熱(re)(re)(re)敏(min)膠(jiao)粘(zhan)劑受熱(re)(re)(re)熔(rong)化后粘(zhan)性增(zeng)加，使(shi)得鋁(lv)(lv)層(ceng)與電(dian)(dian)化鋁(lv)(lv)基(ji)膜剝離(li)的同時轉印(yin)(yin)到了承(cheng)(cheng)印(yin)(yin)物上(shang)。隨著壓力的卸除(chu)，膠(jiao)粘(zhan)劑迅速冷卻固(gu)化，鋁(lv)(lv)層(ceng)牢固(gu)地附(fu)著在(zai)(zai)承(cheng)(cheng)印(yin)(yin)物上(shang)，完成一個燙(tang)印(yin)(yin)過程。