燙(tang)金(jin)基本(ben)工藝(yi)是在壓力狀態(tai)，即電化(hua)(hua)鋁(lv)被燙(tang)印(yin)(yin)版、承(cheng)印(yin)(yin)物(wu)壓住的狀態(tai)下，電化(hua)(hua)鋁(lv)受熱(re)(re)使(shi)(shi)其上(shang)(shang)熱(re)(re)熔(rong)(rong)性(xing)的有機硅(gui)樹脂(zhi)層和(he)膠牯劑熔(rong)(rong)化(hua)(hua)，此時受熱(re)(re)熔(rong)(rong)化(hua)(hua)的有機硅(gui)樹脂(zhi)粘(zhan)性(xing)變小，而(er)特種熱(re)(re)敏(min)膠粘(zhan)劑受熱(re)(re)熔(rong)(rong)化(hua)(hua)后粘(zhan)性(xing)增加，使(shi)(shi)得鋁(lv)層與電化(hua)(hua)鋁(lv)基膜剝離的同時轉印(yin)(yin)到(dao)了承(cheng)印(yin)(yin)物(wu)上(shang)(shang)。隨著(zhu)壓力的卸(xie)除，膠粘(zhan)劑迅速冷(leng)卻固(gu)化(hua)(hua)，鋁(lv)層牢(lao)固(gu)地(di)附著(zhu)在承(cheng)印(yin)(yin)物(wu)上(shang)(shang)，完(wan)成一個燙(tang)印(yin)(yin)過程。