燙(tang)金(jin)基本(ben)工藝是(shi)在(zai)壓力(li)狀(zhuang)態，即(ji)電化(hua)(hua)鋁(lv)(lv)被燙(tang)印(yin)(yin)版(ban)、承印(yin)(yin)物壓住的狀(zhuang)態下，電化(hua)(hua)鋁(lv)(lv)受(shou)熱(re)使其(qi)上(shang)熱(re)熔(rong)性(xing)的有(you)(you)機硅樹脂(zhi)層(ceng)和膠牯劑熔(rong)化(hua)(hua)，此時受(shou)熱(re)熔(rong)化(hua)(hua)的有(you)(you)機硅樹脂(zhi)粘(zhan)(zhan)性(xing)變(bian)小，而(er)特(te)種(zhong)熱(re)敏膠粘(zhan)(zhan)劑受(shou)熱(re)熔(rong)化(hua)(hua)后(hou)粘(zhan)(zhan)性(xing)增加，使得鋁(lv)(lv)層(ceng)與電化(hua)(hua)鋁(lv)(lv)基膜剝離的同(tong)時轉印(yin)(yin)到了承印(yin)(yin)物上(shang)。隨著(zhu)壓力(li)的卸(xie)除，膠粘(zhan)(zhan)劑迅速冷(leng)卻固化(hua)(hua)，鋁(lv)(lv)層(ceng)牢(lao)固地附著(zhu)在(zai)承印(yin)(yin)物上(shang)，完(wan)成一個燙(tang)印(yin)(yin)過程。