燙(tang)金(jin)基本工藝是在(zai)壓力(li)狀(zhuang)態，即(ji)電(dian)化(hua)(hua)鋁(lv)(lv)(lv)(lv)被燙(tang)印版、承印物壓住(zhu)的(de)狀(zhuang)態下，電(dian)化(hua)(hua)鋁(lv)(lv)(lv)(lv)受熱(re)(re)使其上(shang)熱(re)(re)熔(rong)性(xing)的(de)有(you)(you)機硅(gui)樹脂(zhi)層和膠(jiao)牯劑(ji)熔(rong)化(hua)(hua)，此時受熱(re)(re)熔(rong)化(hua)(hua)的(de)有(you)(you)機硅(gui)樹脂(zhi)粘(zhan)(zhan)性(xing)變小，而特(te)種熱(re)(re)敏膠(jiao)粘(zhan)(zhan)劑(ji)受熱(re)(re)熔(rong)化(hua)(hua)后(hou)粘(zhan)(zhan)性(xing)增(zeng)加，使得(de)鋁(lv)(lv)(lv)(lv)層與電(dian)化(hua)(hua)鋁(lv)(lv)(lv)(lv)基膜剝離的(de)同時轉(zhuan)印到了承印物上(shang)。隨著壓力(li)的(de)卸除(chu)，膠(jiao)粘(zhan)(zhan)劑(ji)迅速冷卻固(gu)化(hua)(hua)，鋁(lv)(lv)(lv)(lv)層牢(lao)固(gu)地附著在(zai)承印物上(shang)，完(wan)成一個燙(tang)印過程(cheng)。