燙金(jin)基(ji)本(ben)工藝是(shi)在(zai)壓力狀態，即電(dian)化(hua)(hua)鋁(lv)被燙印(yin)(yin)版(ban)、承(cheng)印(yin)(yin)物壓住的(de)狀態下，電(dian)化(hua)(hua)鋁(lv)受熱(re)使(shi)其上熱(re)熔(rong)(rong)性(xing)的(de)有機硅樹脂(zhi)層和膠牯劑熔(rong)(rong)化(hua)(hua)，此時(shi)受熱(re)熔(rong)(rong)化(hua)(hua)的(de)有機硅樹脂(zhi)粘(zhan)(zhan)性(xing)變小，而特種熱(re)敏膠粘(zhan)(zhan)劑受熱(re)熔(rong)(rong)化(hua)(hua)后粘(zhan)(zhan)性(xing)增(zeng)加，使(shi)得鋁(lv)層與電(dian)化(hua)(hua)鋁(lv)基(ji)膜剝離的(de)同(tong)時(shi)轉印(yin)(yin)到(dao)了承(cheng)印(yin)(yin)物上。隨著(zhu)壓力的(de)卸(xie)除(chu)，膠粘(zhan)(zhan)劑迅速(su)冷卻固(gu)(gu)化(hua)(hua)，鋁(lv)層牢固(gu)(gu)地附著(zhu)在(zai)承(cheng)印(yin)(yin)物上，完成(cheng)一個燙印(yin)(yin)過程。