燙(tang)金基(ji)本工藝是在壓力狀態(tai)，即電(dian)化(hua)(hua)鋁(lv)被燙(tang)印(yin)(yin)版、承印(yin)(yin)物壓住(zhu)的狀態(tai)下，電(dian)化(hua)(hua)鋁(lv)受(shou)熱(re)使其上熱(re)熔(rong)(rong)性的有(you)機(ji)硅樹脂(zhi)(zhi)層和(he)膠(jiao)牯劑熔(rong)(rong)化(hua)(hua)，此時受(shou)熱(re)熔(rong)(rong)化(hua)(hua)的有(you)機(ji)硅樹脂(zhi)(zhi)粘(zhan)性變小，而特(te)種熱(re)敏膠(jiao)粘(zhan)劑受(shou)熱(re)熔(rong)(rong)化(hua)(hua)后粘(zhan)性增加，使得鋁(lv)層與(yu)電(dian)化(hua)(hua)鋁(lv)基(ji)膜剝離(li)的同(tong)時轉印(yin)(yin)到了(le)承印(yin)(yin)物上。隨著壓力的卸除(chu)，膠(jiao)粘(zhan)劑迅速冷卻固化(hua)(hua)，鋁(lv)層牢固地附著在承印(yin)(yin)物上，完成一個燙(tang)印(yin)(yin)過程。