燙金基(ji)本工藝是(shi)在(zai)壓力狀(zhuang)態，即電化(hua)(hua)(hua)(hua)鋁(lv)(lv)被燙印(yin)(yin)版、承(cheng)(cheng)印(yin)(yin)物(wu)壓住的狀(zhuang)態下，電化(hua)(hua)(hua)(hua)鋁(lv)(lv)受熱(re)使其(qi)上熱(re)熔(rong)性的有機(ji)硅樹(shu)脂層和(he)膠(jiao)牯(gu)劑熔(rong)化(hua)(hua)(hua)(hua)，此時受熱(re)熔(rong)化(hua)(hua)(hua)(hua)的有機(ji)硅樹(shu)脂粘性變小，而特種(zhong)熱(re)敏膠(jiao)粘劑受熱(re)熔(rong)化(hua)(hua)(hua)(hua)后粘性增(zeng)加(jia)，使得鋁(lv)(lv)層與電化(hua)(hua)(hua)(hua)鋁(lv)(lv)基(ji)膜剝離的同(tong)時轉印(yin)(yin)到了承(cheng)(cheng)印(yin)(yin)物(wu)上。隨(sui)著(zhu)壓力的卸除，膠(jiao)粘劑迅速冷卻固化(hua)(hua)(hua)(hua)，鋁(lv)(lv)層牢固地(di)附著(zhu)在(zai)承(cheng)(cheng)印(yin)(yin)物(wu)上，完成一個燙印(yin)(yin)過程(cheng)。