燙金基本工藝是在壓力狀態(tai)，即電(dian)化(hua)(hua)鋁(lv)(lv)被(bei)燙印版、承印物(wu)(wu)壓住(zhu)的(de)狀態(tai)下(xia)，電(dian)化(hua)(hua)鋁(lv)(lv)受熱(re)(re)使(shi)其上熱(re)(re)熔(rong)性(xing)的(de)有(you)機硅(gui)樹脂層(ceng)和膠(jiao)牯劑熔(rong)化(hua)(hua)，此時受熱(re)(re)熔(rong)化(hua)(hua)的(de)有(you)機硅(gui)樹脂粘(zhan)性(xing)變(bian)小，而特種熱(re)(re)敏膠(jiao)粘(zhan)劑受熱(re)(re)熔(rong)化(hua)(hua)后粘(zhan)性(xing)增加，使(shi)得(de)鋁(lv)(lv)層(ceng)與電(dian)化(hua)(hua)鋁(lv)(lv)基膜剝離的(de)同時轉印到了承印物(wu)(wu)上。隨著壓力的(de)卸除，膠(jiao)粘(zhan)劑迅速(su)冷卻固化(hua)(hua)，鋁(lv)(lv)層(ceng)牢固地(di)附著在承印物(wu)(wu)上，完成一個燙印過程(cheng)。