燙金基本工藝是在壓力(li)(li)狀態(tai)，即電化(hua)(hua)鋁(lv)(lv)被燙印(yin)版、承(cheng)印(yin)物(wu)壓住(zhu)的狀態(tai)下，電化(hua)(hua)鋁(lv)(lv)受(shou)熱使(shi)其上熱熔(rong)性(xing)的有機(ji)(ji)硅(gui)樹脂層(ceng)和膠(jiao)牯(gu)劑(ji)熔(rong)化(hua)(hua)，此(ci)時(shi)受(shou)熱熔(rong)化(hua)(hua)的有機(ji)(ji)硅(gui)樹脂粘(zhan)性(xing)變小，而(er)特種(zhong)熱敏膠(jiao)粘(zhan)劑(ji)受(shou)熱熔(rong)化(hua)(hua)后粘(zhan)性(xing)增加，使(shi)得鋁(lv)(lv)層(ceng)與(yu)電化(hua)(hua)鋁(lv)(lv)基膜剝離的同時(shi)轉(zhuan)印(yin)到了承(cheng)印(yin)物(wu)上。隨(sui)著壓力(li)(li)的卸除，膠(jiao)粘(zhan)劑(ji)迅速冷卻固(gu)(gu)化(hua)(hua)，鋁(lv)(lv)層(ceng)牢固(gu)(gu)地附著在承(cheng)印(yin)物(wu)上，完(wan)成一個燙印(yin)過(guo)程。