燙金基(ji)本工藝是在(zai)壓(ya)力(li)狀(zhuang)態，即電(dian)(dian)化(hua)鋁被燙印(yin)版(ban)、承(cheng)印(yin)物(wu)(wu)壓(ya)住的狀(zhuang)態下，電(dian)(dian)化(hua)鋁受(shou)熱使(shi)其(qi)上(shang)熱熔(rong)性(xing)的有機硅(gui)樹脂層(ceng)和膠(jiao)牯劑(ji)熔(rong)化(hua)，此時(shi)受(shou)熱熔(rong)化(hua)的有機硅(gui)樹脂粘性(xing)變小，而特種(zhong)熱敏(min)膠(jiao)粘劑(ji)受(shou)熱熔(rong)化(hua)后粘性(xing)增加，使(shi)得鋁層(ceng)與電(dian)(dian)化(hua)鋁基(ji)膜剝(bo)離的同(tong)時(shi)轉印(yin)到了(le)承(cheng)印(yin)物(wu)(wu)上(shang)。隨(sui)著壓(ya)力(li)的卸(xie)除，膠(jiao)粘劑(ji)迅速(su)冷卻(que)固化(hua)，鋁層(ceng)牢固地附著在(zai)承(cheng)印(yin)物(wu)(wu)上(shang)，完成一個燙印(yin)過程。