燙金基(ji)本工藝是在壓力狀態(tai)，即電(dian)化(hua)(hua)(hua)鋁被燙印(yin)(yin)版、承印(yin)(yin)物壓住的狀態(tai)下，電(dian)化(hua)(hua)(hua)鋁受熱使其上(shang)熱熔(rong)(rong)性的有機(ji)硅樹脂層和膠牯劑(ji)熔(rong)(rong)化(hua)(hua)(hua)，此時受熱熔(rong)(rong)化(hua)(hua)(hua)的有機(ji)硅樹脂粘(zhan)(zhan)(zhan)性變小，而(er)特(te)種熱敏膠粘(zhan)(zhan)(zhan)劑(ji)受熱熔(rong)(rong)化(hua)(hua)(hua)后粘(zhan)(zhan)(zhan)性增加(jia)，使得鋁層與電(dian)化(hua)(hua)(hua)鋁基(ji)膜剝離的同(tong)時轉印(yin)(yin)到了承印(yin)(yin)物上(shang)。隨著壓力的卸除，膠粘(zhan)(zhan)(zhan)劑(ji)迅速冷卻固(gu)化(hua)(hua)(hua)，鋁層牢固(gu)地(di)附著在承印(yin)(yin)物上(shang)，完成一個燙印(yin)(yin)過程。