燙(tang)金基本工藝(yi)是在(zai)壓力狀(zhuang)態，即電化(hua)(hua)鋁(lv)(lv)被(bei)燙(tang)印(yin)(yin)版、承印(yin)(yin)物壓住的(de)狀(zhuang)態下，電化(hua)(hua)鋁(lv)(lv)受(shou)熱(re)(re)(re)使其上(shang)熱(re)(re)(re)熔(rong)(rong)性(xing)的(de)有機硅樹(shu)脂(zhi)層和膠牯劑熔(rong)(rong)化(hua)(hua)，此時(shi)受(shou)熱(re)(re)(re)熔(rong)(rong)化(hua)(hua)的(de)有機硅樹(shu)脂(zhi)粘(zhan)(zhan)性(xing)變(bian)小，而特(te)種熱(re)(re)(re)敏膠粘(zhan)(zhan)劑受(shou)熱(re)(re)(re)熔(rong)(rong)化(hua)(hua)后粘(zhan)(zhan)性(xing)增加，使得鋁(lv)(lv)層與電化(hua)(hua)鋁(lv)(lv)基膜剝離的(de)同(tong)時(shi)轉印(yin)(yin)到了承印(yin)(yin)物上(shang)。隨著(zhu)壓力的(de)卸除，膠粘(zhan)(zhan)劑迅(xun)速冷卻固(gu)化(hua)(hua)，鋁(lv)(lv)層牢(lao)固(gu)地附著(zhu)在(zai)承印(yin)(yin)物上(shang)，完(wan)成一個燙(tang)印(yin)(yin)過程(cheng)。